RF Characterization Engineer

Doodle Labs builds the connectivity backbone of the autonomous systems revolution - resilient wireless mesh networks that let drones, robots, and unmanned platforms operate reliably in the world's most demanding environments. We sit at the intersection of defense, robotics, and next-generation autonomy, powering the machines that are changing how militaries, first responders, and industries operate in the field. Our core purpose is simple: connect anyone and anything, at any time, in any place.

For over 25 years, our team has been at the forefront of mesh networking, partnering with leading defense programs, robotics manufacturers, and system integrators worldwide. The work here doesn't sit in a slide deck - it ends up in the field, in the hands of people for whom failure isn't an option.

• Direct ownership of critical RF products that define product performance
• Opportunity to solve complex RF challenges under real‑world constraints.
• High autonomy and technical influence in a fast‑growing robotics and defense technology company
• Exposure to advanced wireless technologies and real production hardware-not just prototypes

1. Deliver Production‑Ready RF Modules (Primary Objective)

• Within the first 4-6 months, study, understand, prepare and test newly developed products like Radios and Bidirectional Amplifier modules.
• Own end‑to‑end RF hardware validation including integrating SW and Mechanical. Prepare SOPs, Conduct environmental tests, planning control or prototype run, collaborate with CAD and mechanical engineers and handover the design and documents to product engineering team (approximately 80% RF / 20% analog), including power supplies, MCU interfaces (UART, SPI, I2C), Ethernet circuitry, and system‑level integration.
• Validate and own working prototypes that meet performance specifications and are ready for manufacturing handoff.

2. Characterize High‑Performance, Flexible, and Compact Radio Modules

• Prepare Test plan based on the specifications, work with CAD engineers to design test jigs, Evaluate EVKs, perform design margin tests, Conduct OTA testing, bench level testing and Environmental testing and qualify the product.

3. Lead Validation, Documentation, and Design Transfer

• Plan and execute RF and system‑level testing, verifying performance against specifications and documenting results clearly.
• Prepare basic but complete design documentation (schematics, test results, design rationale) suitable for long‑term product support.
• Successfully transfer designs to Product Engineering, ensuring smooth ramp into manufacturing without requiring major redesigns.

4. Drive Technical Rigor and Cross‑Functional Execution

• Organize and lead cross functional meetings to align and speed up the development process throughout the project lifecycle, incorporating feedback from RF, PCB, mechanical, and product stakeholders.
• Develop and track project plans and milestones, coordinating closely with cross‑functional partners to meet aggressive timelines.
• Proactively identify technical risks and tradeoffs, recommending solutions that balance performance, cost, schedule, and manufacturability.

• You deliver a validated RF radio module that meets specifications and can be manufactured without major redesign.
• Cross‑functional teams trust your technical judgment and rely on you to move designs forward efficiently.
• Product Engineering can take your designs into production with confidence.

• First 30 days: Learn existing design approaches, tools, and product architecture; evaluate new product requirements and constraints.
• By 60 days: Finalize Test jig PCB designs, support prototype builds, and prepare documentation for testing and validation.
• By 90 days: Derive a structured testing and validation plan, prepare a proper test setup, test and validate the module and verify against the specification, document and transfer to PE team/ production Team.

• PCB design engineers and CAD engineers on test jig designs, Redesign of existing modules etc.
• Mechanical engineers on enclosure, thermal, and integration constraints.
• Product and Product Engineering teams during validation and manufacturing transfer.
• Both junior and senior engineers across the design organization.