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Senior Scientist II, Advanced RF Packaging and Integration

On-site in Singapore·Added 3 months ago (last checked 14 Oct)

A*STAR

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Overview

Skills

The role

We are seeking an RF Scientist to drive innovation in advanced packaging and system integration for next-generation high-frequency devices. This role focuses on the design, modeling, and characterization of RF components within complex packaging architectures. You will contribute to cutting-edge technologies enabling high-performance applications in communications, sensing, and electronics integration.
Key Responsibilities
  • Lead the design and integration of advanced RF packaging solutions (2.5D/3D interposers, FOWLP) for high-frequency and high-performance applications
  • Design and optimize RF components, interconnects, and system-in-package (SiP) architectures
  • Perform EM, signal integrity (SI), and power integrity (PI) simulations to ensure optimal performance (loss, crosstalk, impedance matching)
  • Drive innovation in materials, architectures, and interconnect technologies for heterogeneous integration, including AI and high-performance compute systems
  • Apply data-driven and AI/ML-assisted approaches to modeling, design optimization, and predictive performance/reliability analysis
  • Translate R&D concepts into scalable, manufacturable solutions bridging research and productionLead experimental validation, RF characterization, and reliability analysis, including failure investigation and iterative design improvement
  • Collaborate across multidisciplinary teams to co-design integrated chip-package-system solutions, including photonics, MEMS, and integrated thermal solutions, for next-generation AI, communications, and sensing platforms.
  • Contribute to technology roadmaps, intellectual property (IP) development, and technical publications

Required Qualifications

  • PhD or Master's degree in Electrical Engineering, Applied Physics, or related field
  • Strong background in RF/microwave engineering and electromagnetics
  • Experience with RF simulation tools (e.g., HFSS, CST, ADS, or similar)
  • Knowledge of semiconductor packaging technologies (e.g., flip chip, interposers, fan-out)
  • Experience in RF measurement techniques (VNA, spectrum analyzer, probe stations)
  • Strong analytical and problem-solving skills

Preferred Qualifications

  • Experience with mmWave or high-frequency systems
  • Familiarity with heterogeneous integration and system-in-package (SiP) design
  • Knowledge of materials and thermal/mechanical considerations in packaging
  • Programming or scripting skills (Python, MATLAB, etc.)

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