Senior Research Engineer II, fan-in/fan-out wafer-level pkg, 2.5D interposers, Adv Pkg, IME

Job Description

Senior Research Engineer, Advanced Packaging

IME's Advanced Packaging Programme is looking for a passionate Engineer to drive prototyping and small-volume manufacturing activities using state-of-the-art packaging platforms such as fan-in/fan-out wafer-level packaging, 2.5D interposers, and W2W/C2W 3D integration. The successful candidate will play a key role in developing innovative package architectures, advancing technology demonstrations, and working closely with researchers and industry collaborators to translate concepts into functional prototypes. The role focuses on delivering high-quality products, ensuring process stability, coordinating manufacturing operations.

Job Responsibilities

• Plan, coordinate, and execute prototype and small-volume manufacturing runs using advanced packaging technologies, including Fan-In/Fan-Out Wafer Level Packaging (FOWLP), 2.5D interposers, and W2W/C2W 3D integration.
• Develop manufacturing plans, process flows, and work instructions to meet customer and project requirements.
• Monitor production activities, troubleshoot process issues, and implement corrective actions to improve yield, quality, and cycle time.
• Work closely with process, equipment, and quality engineers to ensure stable and repeatable manufacturing performance.
• Coordinate wafer and material logistics, production scheduling, and resource allocation to ensure on-time delivery.
• Perform process monitoring, yield analysis, failure analysis, and root-cause investigations.
• Support customer prototype builds, engineering lots, and qualification activities.
• Drive continuous improvement initiatives to enhance manufacturing efficiency, quality, and operational excellence.
• Maintain manufacturing documentation, including process specifications, manufacturing reports, and quality records.
• Ensure compliance with safety, quality, and operational procedures

Job Requirement

• Bachelor's, master's degree in electrical engineering, Materials Science, Mechanical Engineering, Microelectronics, or a related discipline.
• 5-10 years of experience in semiconductor manufacturing, advanced packaging, process integration, or related fields.
• Knowledge of semiconductor packaging processes such as lithography, plating, RDL formation, wafer thinning, bonding, molding, and assembly is advantageous.
• Hands-on experience in prototype builds or low-volume manufacturing environments.
• Knowledge of 2.5D/3D IC integration, hybrid bonding, chiplet packaging, or heterogeneous integration technologies.
• Experience with manufacturing execution systems (MES), quality management systems, and process qualification methodologies.
• Familiarity with statistical process control (SPC), yield analysis, and problem-solving methodologies.
• Strong analytical, troubleshooting, and data analysis skills.
• Ability to work effectively in a multidisciplinary team environment and interact with internal and external stakeholders.
• Excellent communication and project coordination skills.