Principal Research Engineer - Front-End Semiconductor Equipment Engineering

About the Role

We are seeking an accomplished Principal Engineer / Senior Principal Engineer to lead the technical direction and translation of manufacturing innovations to enable end-to-end engineering delivery of equipment solutions for the front-end semiconductor domain. This is a senior technical leadership role for an experienced engineer who combines deep hands-on expertise in semiconductor process/equipment engineering with the ability to drive complex equipment programmes from concept through to production-ready deployment. The successful candidate will take full ownership of equipment solution development - spanning concept and architecture definition, detailed design, fabrication, integration, qualification, and production readiness - while working closely with researchers, industry collaborators, and toolmakers to resolve complex technical challenges and accelerate real-world deployment. This role also carries a mandate to lead industry and exploratory engineering projects that generate impactful outcomes for the semiconductor sector and for Singapore. This is a unique opportunity for a seasoned semiconductor equipment engineer to shape how next-generation front-end process and equipment technologies are engineered, validated, and brought into industrial use.

Key Responsibilities

1. Technical Direction and Engineering Delivery - Concept to Industrial Adoption

• Develop manufacturing technologies for high-value semiconductor equipment components, sub-modules and process modules for front-end semiconductor equipment (e.g. Plasma Vapour Deposition, Chemical Vapour Deposition, Atomic Layer Deposition, Etch, Ion Implantation and related wafer fabrication equipment), ensuring performance, reliability, and manufacturability.
• Translate process and equipment requirements into component and manufacturing specifications
• Execute design reviews, risk assessments, fabrication, integration, testing, and qualification activities.
• Drive production readiness activities - including design for manufacturability, reliability engineering, safety compliance, documentation, and technology transfer - to ensure developed equipment and manufacturing innovations can be scaled and deployed in an industrial or fab environment.

2. Cross-Functional & Industry Collaboration

• Work directly with industry collaborators (foundries, IDMs, equipment/tooling suppliers, and ecosystem partners) to align equipment innovations with real manufacturing needs and accelerate deployment timelines for next-generation equipment and manufacturing solutions.
• Act as the key technical point of contact for equipment-related engineering challenges raised by research teams or industry partners, driving fast, effective root-cause analysis and resolution.

Key Responsibilities

3. Project & Programme Leadership

• Lead industry-linked and exploratory engineering projects from scoping through delivery, ensuring technical excellence, schedule adherence, and impactful outcomes.
• Support the development of technical proposals and contribute engineering input to secure funding for large equipment-related programmes.
• Manage project risk, technical resourcing, and timelines across multiple concurrent equipment development efforts.
• Define success metrics and milestones for equipment programmes, and report progress to stakeholders and leadership.

4. Technical Leadership & Capability Building

• Serve as a recognised technical authority in front-end semiconductor equipment engineering, providing hands-on guidance and mentorship to engineers across the team.
• Champion engineering best practices, including design reviews, failure mode analysis, and lessons-learned processes, to raise the overall engineering maturity of the organisation.
• Contribute to building engineering capability and infrastructure (tools, test benches, fabrication and metrology capacity) needed to stay at the leading edge of equipment technology.
• Support recruitment, development, and retention of strong engineering talent within the domain.

Key Responsibilities

5. Innovation & National Impact

• Identify opportunities to apply novel engineering approaches, materials, or technologies to solve persistent equipment challenges in the front-end semiconductor space.
• Contribute engineering perspective to technology foresighting activities, helping ensure research directions remain grounded in engineering feasibility and industrial relevance.
• Represent the organisation in industry technical forums, equipment supplier engagements, and relevant working groups.
• Contribute to the broader mission of strengthening Singapore's semiconductor equipment and manufacturing ecosystem.

Eligibility Criteria - Education

• Bachelor's or Master's degree in Mechanical Engineering, Electrical/Electronic Engineering, Chemical Engineering, Materials Science, Physics, Mechatronics, or a closely related engineering discipline.

Eligibility Criteria - Experience

• At least 15 years of relevant hands-on engineering experience in the front-end semiconductor industry, ideally spanning both equipment/toolmaker environments and fab/process engineering environments.
• Demonstrated experience owning equipment solutions across the full development lifecycle - concept, architecture, detailed design, fabrication, integration, qualification, and production/industrial deployment.
• Deep working knowledge of one or more front-end semiconductor equipment areas, such as:
• Deposition, etch, or cleaning equipment
• Lithography or patterning-related equipment/modules
• Metrology and inspection systems
• Wafer handling, automation, and process control systems
• Thermal, vacuum, or plasma sub-systems
• Proven track record of resolving complex, multi-disciplinary technical challenges under real deployment constraints (cost, schedule, reliability, safety, and regulatory/compliance requirements).
• Experience directly collaborating with semiconductor foundries, IDMs, or equipment/materials suppliers, with tangible outcomes in accelerated technology deployment or technology transfer.
• Track record of leading engineering teams or projects, including technical mentorship of junior and mid-level engineers.
• Experience contributing to or leading proposals for large equipment-related engineering programmes (an advantage, not mandatory).

Eligibility Criteria - Skills & Attributes

• Strong systems-level thinking, able to architect complex multi-disciplinary equipment solutions, and commitment to safety, quality and delivery.
• Excellent hands-on engineering judgement, comfortable working across design, fabrication, and integration phases rather than purely at a conceptual level.
• Strong stakeholder management skills, able to work effectively with researchers, industry partners, suppliers, and cross-functional engineering teams.
• Excellent problem-solving skills, with a structured approach to root-cause analysis and risk management.
• Clear written and verbal communication skills, able to explain complex engineering trade-offs to technical and non-technical stakeholders alike.
• Self-driven, pragmatic, and outcome-oriented, with a strong bias toward translating ideas into working, deployable solutions.
• Strong professional network within the semiconductor equipment and manufacturing ecosystem.

Eligibility Criteria - Preferred (not mandatory)

• Prior experience in an equipment supplier/toolmaker, semiconductor fab, or national research institute with an equipment engineering mandate.
• Experience with design-for-manufacturability, reliability engineering, or equipment safety/compliance standards (e.g., SEMI standards).
• Experience operating within or engaging with the Asia-Pacific semiconductor ecosystem, particularly Singapore's ecosystem.
• Relevant patents or engineering publications related to semiconductor process equipment.

The above eligibility criteria are indicative; additional selection criteria may be applied in line with prevailing recruitment policies. Only shortlisted candidates will be notified.