Principal Research Engineer, Advanced Packaging

Job Description

We are seeking a results-oriented leader for platform technology integration in Advanced Packaging department developing system-in-package at wafer level. The candidate will be responsible for defining the medium-to-long term process capability roadmap to support packaging platform technologies, developing 2.5D TSV interposers, and integrating optics with electronics using highly scaled u-bump and hybrid bond technologies for networking and high-performance computing interconnects.

Key Responsibilities:

• Evaluate industry trends and define differentiated platform technology architectures to obtain competitive advantage.
• Define simplest process flow with minimum number of process steps to realise platform technology architectures at lowest cost.
• Identify technology gaps and weak links with clear specifications for process module and make process module accountable for timely delivery.
• Realize platform architectures by closely working with a team of designers, integrators, process module and fab.
• Engage industry customers from proof of concept to low volume prototyping/manufacturing.
• Act as a project leader for industry, consortium, and internal core capability projects.
• Act as an influencer in internal leadership and industry collaborations.
• Build, mentor, and retain a high-performing team to deliver impact.
• Foster a culture of agility, technical excellence, individual and team innovation, intra-/inter-department collaboration, and continuous improvement.
• Effectively manage research funding obtained through grant proposals, industry partnerships, and strategic collaborations.
• Able to manage resource allocation efficiently amid competing priorities.
• Establish clear goals, metrics, and milestones to evaluate progress on technology development initiatives.
• Ensure effective project management, documentation, and knowledge dissemination across multidisciplinary teams.

Requirements

• Bachelor or Masters degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, Mechanical Engineering, or a related field.
• 15 years of experience in semiconductor industry, with expertise in device fabrication, Cu backend integration and exposure to advanced packaging technologies and managing projects and teams.
• Broad knowledge of multiple process technologies including lithography, etch, diffusion/thin films, electroplating, CMP, bonding.
• Strong understanding of considerations in process development cycle including early pathfinding and manufacturing scalability.
• Strong, hands-on people manager demonstrating excellent leadership, communication, and strategic thinking skills.
• Extensive experience working in a diverse, matrixed environment and collaborating across functions.